Electronics Assembly Quality Engineer

What You'll Do7

• Interpret X-ray images of BGA, CGA, and LGA solder joints to spot defects such as voiding, head-in-pillow, bridging, and opens.
• Review reflow soldering profiles and recommend changes that address process-related solder defects.
• Perform detailed root cause analysis for solder joint anomalies and reliability concerns, then provide recommendations.
• Assess real-world cases against IPC Class 3 acceptance criteria, documenting critical observations and decision criteria.
• Evaluate and outline test laboratory flows for counterfeit electronic component detection and screening.
• Deliver written and verbal summaries of findings that are clear and actionable.
• Contribute technical insights that improve AI training data quality in electronics assembly and component validation.

Requirements7

• Hands-on experience in electronics manufacturing process or quality engineering, particularly with area-array packages.
• Advanced proficiency in interpreting X-ray images and diagnosing solder joint failures.
• Strong expertise in reflow soldering process optimization and troubleshooting.
• Familiarity with IPC acceptance standards, especially Class 3 requirements for critical applications.
• Experience with counterfeit component detection test methodologies and laboratory practices in component authentication.
• Exceptional written and verbal communication skills for technical documentation and cross-functional knowledge sharing.
• Background as a process engineer, quality engineer, or laboratory analyst in electronics assembly or component screening, with a clear strength area.

Who Should Apply

Process engineers, quality engineers, and laboratory analysts with hands-on experience in area-array solder joint inspection, reflow optimization, and counterfeit component screening. Candidates should be ready to document findings clearly and indicate whether their strength lies in process quality or counterfeit analysis.

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